文章资讯
-
- 2014-10-31 Low-power microcontroller family with up to 1MB of on-chip flash unveiled
Renesas Electronics today announced the availability of a large number of new low-power, low voltage microcontrollers (MCUs). By expanding the low-power, low-voltage RX200 Series to include versions offering from 64 KB to 1 MB of on-chip flash memory, and package sizes from 48-pin LQFP to 145-pin LGA, Renesas now offers the broadest range of low-power 32-bit solutions in the industry. Combined with active mode power consumption of 7.2 mA at 50 MHz operation and a standby mode of 0.4 µA, the RX200 series is positioned to become the de-facto choice of designers looking for the lowest power and highest performance in a 32-bit MCU.
"Embedded MCU applications like smart meters and portable healthcare devices require increased levels of functionality while operating under very low power and varying voltage constraints," said Ritesh Tyagi, senior director, Microcontroller Products & Solutions Marketing, Renesas Electronics America Inc. "The combination of the high-performance 32-bit RX CPU, which delivers 3.08 CoreMark / MHz, and operation at voltages as low as 1.62v and as high as 5.5v, means that the RX200 family provides system designers with the highest possible performance across the widest range of system requirements..
- See Details
-
- 2014-10-31 Caltech engineers build electronic chips that repair themselves
Imagine that the chips in your smart phone or computer could repair and defend themselves on the fly, recovering in microseconds from problems ranging from less-than-ideal battery power to total transistor failure. It might sound like the stuff of science fiction, but a team of engineers at the California Institute of Technology (Caltech), for the first time ever, has developed just such self-healing integrated chips.
The team, made up of members of the High-Speed Integrated Circuits laboratory in Caltech's Division of Engineering and Applied Science, has demonstrated this self-healing capability in tiny power amplifiers. The amplifiers are so small, in fact, that 76 of the chips-including everything they need to self-heal-could fit on a single penny. In perhaps the most dramatic of their experiments, the team destroyed various parts of their chips by zapping them multiple times with a high-power laser, and then observed as the chips automatically developed a work-around in less than a second.
- See Details
-
- 2014-10-30 Sell LINEAR TECH (LT) all series Integrated Circuits (ICs) - TAMS SEMICONDUCTOR LIMITED
- Plz feel free to give us a call or email when you need any electronic components (semiconductor).
TAMS SEMICONDUCTOR LIMITED sells LINEAR TECH (LT) all series Integrated Circuits (ICs); Clock/Timing, Data Acquisition - ADCs/DACs, Interface - Drivers, Receivers, Transceivers,Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps, Linear - Comparators, Logic - Multivibrators, PMIC - AC DC Converters, LED Drivers, Power Management,Voltage Regulators, RF/IF and RFID, Sensors, Transducers, electronic components(semiconductor). We are the stocking distributor of LINEAR TECH(LT) electronic components semiconductor.Below are some part number:
LT1086CM#TR
LT1086CM-3.3
LT1086CT
LT1086CT-3.3
LT1086IM
LT1086IT
LT1086IT#32**UCLOC-HSD/TR
LT1088CD
LT10912
LT1097
LT1097CN8
LT1097CS8
LT1101CSW
LT1101ISW
LT1102CN8
LT1107CN8
LT1107CS8
LT1107IS8
LT11085
LT1109A1
LT1109ACN8
LT1109ACN8-12
LT1109ACS8
LT1109ACS8-12
LT1109AIS8
LT1109CS8-12
LT1110CS8
LT1110CS8-12
LT1111CS8
LT1111CS8-5
LT1112CS8
LT1112S8
LT1113CS8
LT1114CN
LT1114S
LT1114S14
LT1115CN8 - See Details
-
- 2014-10-30 First ADC device in family of 28nm CMOS converter solutions
- Fujitsu Semiconductor Europe, a market-leading provider of high-speed data converters, has enabled the large-scale deployment of single-wavelength 100Gbps optical transport systems worldwide. Fujitsu's expertise in mixed-signal, thermal, power-optimisation and high-performance package design are key ingredients for providing SoC ASIC solutions to system vendors, paving the way for the necessary upgrade to global networking infrastructure brought on by ever-increasing bandwidth demand and traffic flow.
This demand is expected to move the requirement for 100Gbps capacity lambdas from the long-haul network, running over a few thousand kilometres, to the mid-haul, or Metropolitan Area Network (MAN). Distances are shorter in Metro networks (up to a few hundred kilometres), but port densities are higher so mechanical and thermal constraints will push 100Gbps SoC designs to be correspondingly even more power-efficient. - See Details
-
- 2014-10-30 TAMS SEMICONDUCTOR LIMITED Sell INFINEON all series (in stock)
- TAMS SEMICONDUCTOR LIMITED sells INFINEON all series electronic components(rectifier, semiconductor). We are the stocking distributor of INFINEON electronic components semiconductor.
Below are some of the part number of INFINEON, please send us an email if you have any demands.
BCR198B6327
BCR35PNE6327
BCR400W
BCV27-E6327
BCW61CE-6327
BDP954-E6327
BF2330R E6814
BF776E6327
BF799WE6327
BFG19S E6327
BFP183E7764
BFP-183-E7764
BFP183W E6327
BFP320WE6327
BFP320WE6700
BFP405 E6327
BFP420
BFP420E6327
BFP420-E6327
BFP420E-6327
BFP450-E6327
BFP520 E6327
BFP520E6327
BFP520-E6327
BFP540-E6327
BFP620
BFP620E6327
BFP620E7764
BFP620-E7764 - See Details
-
- 2014-10-30 Atotech and CWRU to shrink wiring for smaller semiconductors
The world's lead manufacturer of chemicals for the metal finishing and electroplating industry has just signed a major research contract with Case Western Reserve University, aimed at developing novel chemistries and processes that will enable the manufacturing of smaller semiconductor devices than heretofore possible in routine production.
Such smaller semiconductors are critical to the fabrication of more powerful and more capable computers, phones and other electronic devices.
Atotech Deutschland GmbH, headquartered in Berlin, a global company with 4000 employees, has been collaborating with researchers at Case Western Reserve University for the past six years on developing improved chemistries and characterization techniques for advanced metallization of semiconductor devices by electroplating.
- See Details
-
- 2014-10-30 Signal processing: Look-up tables to shoulder the processing load
Advanced mathematical algorithms are essential for processing electronic signals within computers and embedded processors. Scientists and engineers are constantly refining and redesigning their algorithms to obtain higher throughput of information on ever smaller devices that consume less power.
Now, Pramod Kumar Meher of the A*STAR Institute for Infocomm Research in Singapore and co-workers at Central South University in Changsha, China, have developed an efficient new method to implement an important step insignal processing, called the discrete cosine transform (DCT). Their method could lead to devices that occupy smaller areas, provide higher throughput of information, and consume less power than existing devices.
- See Details
-
- 2014-10-30 Sell EPCOS all series capacitors electronic components IC semiconductor
- Please feel free to give us a call or email us when you need any electronic components (semiconductor).
We (TAMS SEMICONDUCTOR LIMITED), a stocking distributor of EPCOS electronic components semiconductor, sell EPCOS all series Capacitors, Filters, Inductors, Sensors, Transducers, Coils, Chokes, Integrated Circuits(ICs), electronic components(semiconductor).
Below are some part number:
B39281-B3639-U310
B7302
B39212-B7752-C910
B39389-K3953-M100
K3953M
B39182-B9019-E610
B4124
B39441-B4124-U410
B7843
B39941-B7706-B610
B39860-B4858-Z710
B39380-K3966-N201
B39458-M3573-N301
K3966D
B39192-B7758-E311
B39941-B9024-E610
B7831
B39192-B7759-C810
B39941-B7820-C710
B39380-K9352-M100
F812QPL
B39380-K9351-N201
K3951D
B39389-K9656-M100
K9656M
B39172-B4692-Z810 - See Details
-
- 2014-10-30 Fully integrated silicon photonics platform in a multi-project wafer service
Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab. The platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) and optical sensing and life science applications. The offered integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high-speed germanium waveguide photo-detectors.
Since 2007, imec and its associated laboratory at Ghent University have been offering a platform for passive silicon photonic components via ePIXfab, for R&D under shared cost conditions. Now, imec extends itssilicon photonics offering, using a standard 130nm CMOS toolset, with active components such as high-speed optical modulators and integrated germanium photo-detectors.
- See Details
-
- 2014-10-30 New 1 Mbit and 2 Mbit FRAM products released by Fujitsu
Fujitsu Semiconductor today announced the development of two new FRAM products, MB85RS1MT and MB85RS2MT, which feature 1 Mbit and 2 Mbit of memory, respectively, making them the largest density serial-interface FRAM products offered by Fujitsu Semiconductor. The new products will be made available in sample quantities starting end of March 2013.
The two new FRAM products guarantee 10 trillion read/write cycles, roughly ten times more than existing chips, making them optimal for use in applications such as smart meters, industrial machinery and medical devices. Compared to identical density EEPROM, MB85RS1MT and MB85RS2MT consume 92% less power during writing.- See Details
-
- 2014-10-30 Toshiba debuts 600V Super Junction MOSFET DTMOS IV high-speed diode series at APEC 2013
This week at APEC 2013, Toshiba America Electronic Components will introduce a new lineup of high-speed diodes (HSD): the TK16A60W5, TK31J60W5 and TK39J60W5. Based on Toshiba's fourth generation 600V system super junction MOSFET DTMOS IV series, the new lineup of HSDs improve power efficiency in switching power supplies, micro inverters, adaptors, and photovoltaic inverters. The new HSDs will be highlighted in Toshiba's booth #919 on the APEC show floor from March 17-21.
Using the latest single epitaxial process, this series has achieved the industry's highest level of RON•A and high speed parasiticdiodes. The TK16A60W5, TK31J60W5 and TK39J60W5 can further reduce loss by achieving a recovery time that is one third that of previous models, which significantly contributes to improvements in power efficiency.
- See Details
-
- 2014-10-30 Distributor of ALTERA all series (FPGA, CPLD, ASIC)
- Please feel free to call us or email us when you need any electronic components (semiconductor).
TAMS SEMICONDUCTOR LIMITED sells ALTERA all series electronic components(semicondutor). FPGA, CPLD, ASIC. We are a stocking distributor of ALTERA electronic components semiconductor.
Below are some part number:
EP1K100QC208-2
EP1K100QC208-2N
EP1K100QC208-3N
EP1K100QI208-2
EP1K10QC208-3
EP1K10QC208-3N
EP1K10TC144-1
EP1K10TC144-3N
EP1K10TI144-2
EP1K30FC256-3N
EP1K30FI256-2N
EP1K30QC208
EP1K30QC208-1N
EP1K30QC208-2N
EP1K30QC208-3N
EP1K30QI208-2N - See Details
-
- 2014-10-29 Simplified method to identify the presence of phthalate esters
Fujitsu Laboratories Limited has announced the development of a method that can identify the presence of phthalate esters, such as bis(2-ethylhexyl) phthalate (DEHP), which are considered toxic in polyvinyl chloride (PVC). This new method can distinguish such phthalate esters with more than ten times the sensitivity of previous methods.
In the past, high-precision measuring of phthalate content has required expensive analytic equipment and specialized training. While relatively simple and inexpensive measurement methods are known, their sensitivity is poor. With the new method developed by Fujitsu, called the "vapor collection method," a sample is heated, and the resultant phthalate vapor is collected on a PVC film, enabling the identification of the presence of phthalate esters with ten times the sensitivity of previous methods.
- See Details
-
- 2014-10-29 Researchers utilize atomic layer etch analysis to accelerate development of green chemistries
- Researchers sponsored by Semiconductor Research Corporation (SRC) today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases. The novel approach under way at the University of California, Los Angeles (UCLA) will identify and evaluate green plasma chemistries for processing emerging memory/logic devices and through-silicon-via (TSV)-enabled technologies for the semiconductor industry.
In order to continue the advancement of transistor and memory cell performance, the research will focus on several promising new materials that have been introduced for future generations of integrated circuits (ICs). To exploit this opportunity, the industry requires new and effective etch processes with which to pattern the next-generation fabrics.
- See Details
-
- 2014-10-29 IBM researchers find new molecular technique to charge memory chips
- IBM today announced a materials science breakthrough at the molecular level that could pave the way for a new class of non-volatile memory and logic chips that would use less power than today's silicon devices like cell phones. Rather than using conventional electrical means to charge today's semiconductors, IBM's scientists discovered a new way to power chips using tiny ionic currents, which are streams of charged molecules that can mimic the event-driven way in which the human brain operates. The research is published today in the journal Science.
Today's computers typically use semiconductors made with CMOS process technology and it was long thought that these chips would double in performance and decrease in size and cost every two years. But the materials and techniques to develop and build CMOS chips are rapidly approaching physical and performance limitations and new solutions may soon be needed to develop high performance and low-power devices.
- See Details
-
- 2014-10-29 Low-power operating system for many: Core LSI for embedded applications
Toshiba Corporation today announced that it has developed an innovative, low power operating system (OS) for many-core processors, targeting application in embedded systems, including automotive products and digital consumer products. An evaluation of the OS on the company's own many-core processor recorded a 24.6% power reduction against the standard OS when running a super resolution program that scaled 1920×1080 pixel images to 3840×2160 resolutions. Details of the new OS were presented at "Design, Automation & Test in Europe (DATE 2013)" in Grenoble, France on March 20.
Recent multimedia processing, including video encoding and decoding and image recognition, requires high performance processors. Many-core processors, with up to dozens of cores, are finding an important role in running these applications. However, there is a problem: the higher the number of cores, the higher total power consumption. Manufactures want low power systems in order to maximize the battery life of mobile devices, and in consideration of the environment.
- See Details
-
- 2014-10-29 Cooled integrated circuit amplifies with lowest noise so far
- Researchers at Chalmers University of Technology, Sweden, have demonstrated an integrated amplifier with the lowest noise performance so far. The amplifier offers new possibilities for detecting the faintest electromagnetic radiation, for example from distant galaxies.
Last year, Chalmers reported a world record for a low-noise amplifier in the prestigious journal Electron Device Letters. The amplifier exhibited a minimum noise figure of 0.018 dB across a bandwidth of 4-8 GHz. However, since the low-noise amplifier was designed in a hybrid solution, scaling up to larger quantities turned out to be very difficult.
- See Details
-
- 2014-10-29 Better, cheaper, faster ways for making (and destroying) memories
For literary types, memory is often linked with Marcel Proust's madeleine cookie, which, in a single bite, launches a nostalgic reverie that lasts through seven volumes. But for scientists and engineers at the University of California, San Diego, 'memory' in the computing sense is all about a different kind of sweet: layer cake.
By following a so-called "layer-cake approach" to data storage and retrieval, all components of such systems evolve in tandem, so that advances in hardware don't rapidly eclipse advances in software, or vice versa. UC San Diego's annual Non-Volatile Memories Workshop (NVMW), now in its fourth year, is an opportunity for the many academic researchers working in the field of non-volatile memories to partner with industry representatives "and bring all the layers together to nudge academics in the right direction," said Steven Swanson, associate professor of computer science at the Jacobs School of Engineering at UC San Diego.
- See Details
-
- 2014-10-29 Computer model provides important clues for the production of tightly packed electronic components
- Greater numbers of ever-smaller components are required to fit on computer chips to meet the ongoing demands of miniaturizing electronic devices. Consequently, computer chips are becoming increasingly crowded. Designers of electronic architectures have therefore followed the lead of urban planners and started to build upward. In so-called 'three-dimensional (3D) packages', for example, several flat, two-dimensional chips can be stacked on top of each other using vertical joints.
Controlling the properties of these complex structures is no easy task, as many factors come into play during production. Faxing Che and Hongyu Li and co-workers from the A*STAR Institute of Microelectronics, Singapore, have now developed a powerful modeling method that allows large-scale simulations—and optimization—of the fabrication process, which provides welcome assistance to designers.
- See Details
-
- 2014-10-29 Shifting the Internet into high gear
(Phys.org) —A new-generation analog-to-digital converter (ADC) developed by a joint IBM-EPFL team has the potential to greatly increase the speed and volume of data that can be transferred over the Internet.
Images, audio, and video could soon travel through cyberspace much faster, using less energy, thanks to a new generation of analog-to-digital converters (ADCs) developed jointly by IBM and EPFL's Microelectronics Systems Laboratory. This technological advance was presented recently at the International Solid-State Circuits Conference, one of the most important annual international electronics conferences, in San Francisco.
- See Details
-
- 2014-10-29 World record silicon-based millimeter-wave power amplifiers
- Two teams of DARPA performers have achieved world record power output levels using silicon-based technologies for millimeter-wave power amplifiers. RF power amplifiers are used in communications and sensor systems to boost power levels for reliable transmission of signals over the distance required by the given application. Further integration efforts may unlock applications in low-cost satellite communications and millimeter-wave sensing.
The first team, composed of performers at the University of Southern California and Columbia University, achieved output power levels of nearly 0.5 W at 45 gigahertz with a 45 nanometer silicon complementary metal oxide semiconductor (CMOS) chip. This world record result for CMOS-based power amplifiers doubles output power compared to the next best reported CMOS millimeter-wave power amplifier. The chip design used multiple stacked 45 nanometer silicon-on-insulator CMOS devices for increased effective output voltage swing and efficient 8-way on-chip power-combining.
- See Details
-
- 2014-10-29 KAIST develops a low-power 60 GHz radio frequency chip for mobile devices
As the capacity of handheld devices increases to accommodate a greater number of functions, these devices have more memory, larger display screens, and the ability to play higher definition video files. If the users of mobile devices, including smartphones, tablet PCs, and notebooks, want to share or transfer data on one device with that of another device, a great deal of time and effort are needed.
As a possible method for the speedy transmission of large data, researchers are studying the adoption of gigabits per second (Gbps) wireless communications operating over the 60 gigahertz (GHz) frequency band. Some commercial approaches have been introduced for full-HD video streaming from a fixed source to a display by using the 60 GHz band. But mobile applications have not been developed yet because the 60 GHz radio frequency (RF) circuit consumes hundreds of milliwatts (mW) of DC power.
- See Details
-
- 2014-10-28 Finding instead of searching
It is easy to lose track of things in large storage facilities but not at the wind turbine manufacturer Enercon's facility in Magdeburg though, where a positioning system with digital inventory management increases transparency and expedites processes.
Up to 50 meters long and weighing tons, therotor blades for wind energy systems that Enercon produces in its facility in Magdeburg are truly impressive. They require the corresponding amount of space when they are stored temporarily at the plant premises of 0.5 square kilometers, waiting to be delivered. For a long time, the external storage facility was organized by telephone, information board and manual documentation. That was a source of potential errors. In addition, it cost a lot to keep the inventory records current, for example when employees moved a module around on the premises. Inventory had to be taken to maintain an overview of the warehouse.
- See Details
-
- 2014-10-28 IBM drives flash technology deeper into the enterprise to speed big data analytics
BM today unveiled a strategic initiative to drive Flash technology further into the enterprise to help organizations better tackle the mounting challenges of Big Data.
Flash, a highly efficient re-writable memory, can speed the response times of information gathering in servers and storage systems from milliseconds to microseconds – orders of magnitude faster. Because it contains no moving parts, the technology is also more reliable, durable and more energy efficient than spinning hard drives.
- See Details
-
- 2014-10-28 Low power, smallest-in-class 32.768-kHz crystal oscillator
Seiko Epson Corporation the world leader of quartz crystal technology today announced that it has begun shipping samples of the SG-3030CM 32.768 kHz crystal oscillator. Epson's SG-3030CM is the smallest 32.768 kHz crystal oscillator available in its class today.
Integrating a crystal resonator and oscillation circuit in a very small package, Epson's SG-3030CM consumes the same amount of current and has a 50% smaller footprint and 65% smaller cubic volume than its predecessor, the Epson SG-3030LC. Epson's new SG-3030CM 32.768 kHz crystal oscillator is just 3.2 mm x 1.5 mm with a maximum thickness of 0.9 mm.
- See Details
-
- 2014-10-28 World's smallest wireless LED lamp unveiled at LIGHTFAIR 2013
At LIGHTFAIR International 2013 today, Thermal Solution Resources, LLC (TSR) introduced the world's smallest wireless LED lamp – the intelliSSL MR16 – which can be controlled remotely from iOS, Android or Windows smartphones, tablets or PCs. The intelliSSL lamp incorporates an ultra-compact driver architecture with a powerful antenna system, designed to maximize reception strength, and uses the ultra-low-power JN5168 wireless microcontroller from NXP Semiconductors N.V.. The TSR intelliSSL wireless MR16 lamp will be featured in the NXP booth this week at LIGHTFAIR (no. 2453) and the LEDdynamics booth (no. 100), as well as the ZigBee Alliance booth (no. 3251) as part of a ZigBee Light Link network.
The patent-pending intelliSSL design provides strong wireless reception, eliminating signal interference even under high temperatures, while conforming to a standard ANSI format – 1.98 inches in diameter and 1.98 inches in length – with a GU 5.3 base. A GU 10 base version is planned for release later this year. Compliant with the IEEE 802.15.4 standard for wireless communication, TSR's new wireless MR16 LED can be used with a wide range of network software stacks, including ZigBeeLight Link, ZigBee Home Automation and JenNet-IP.
- See Details
-
- 2014-10-28 Engineers generate world-record mm-wave output power from nanoscale CMOS
(Phys.org) —Harish Krishnaswamy, assistant professor of electrical engineering at Columbia Engineering, has generated a record amount of power output—by a power of five—using silicon-based nanoscale CMOS (complementary metal oxide semiconductor) technology for millimeter-wave power amplifiers. Power amplifiers are used in communications and sensor systems to boost power levels for reliable transmission of signals over long distances as required by the given application. Krishnaswamy's research will be reported at the June 2013 Institute of Electrical and Electronics Engineers Radio Frequency Integrated Circuits Symposium.
Used in virtually all forms of electronics around us, from phones to PCs, laptops, and tablets to satellite communications, nanoscale CMOS technologies have enabled the digital and communication revolution over the past 20 to 30 years. While nanoscale CMOS can do many things, Krishnaswamy explains the one thing that it cannot do very well is generate large amounts of power at high frequencies.
- See Details
-
- 2014-10-28 NXP extends links to LPCXpresso ecosystem with LPC-link 2
NXP Semiconductors today introduced LPC-Link 2 – the first standalone debug adapter of its kind, which can link a variety of popular IDEs (integrated development environments) to any microcontroller development board. The LPCXpresso-IDE, developed by Code Red Technologies, works out of the box with LPC-Link 2. In addition, several firmware images are available for LPC-Link 2 which make it compatible with other tools, including the popular SEGGER J-Link and the CMSIS-DAP debugger designed by ARM.
"LPC-Link 2 provides embedded developers with unprecedented flexibility and choice, enabling them to connect their favorite IDEs and development tools to nearly any type of board, at a very low cost," said Henrik Flodell, tools and embedded ecosystem manager, microcontroller business line, NXP Semiconductors. "With close to 100,000 LPCXpresso boards shipped so far, we're very excited about the introduction of LPC-Link 2 and how it will help to expand the LPCXpresso ecosystem even further."
- See Details
-
- 2014-10-28 Semiconductor technology for particle accelerators
- Corporate Technology (CT), Siemens global research department, has developed a new accelerator technology in cooperation with one of its strategic partners, the Russian research center Skolkovo, which is located near Moscow.
This technology, which is expected to lower the cost of particle accelerators, is featured in the current issue of the research magazine Pictures of the Future. Other partners involved in the project are the Budker Institute for Nuclear Physics in Novosibirsk, the Institute for Theoretical and Experimental Physics in Moscow, Goethe University in Frankfurt am Main and the Gesellschaft für Schwerionenforschung (Society for Heavy Ion Research) in Darmstadt.
- See Details
-
- 2014-10-28 Industry first: Four gigabit LPDDR3 mobile DRAM, using 20nm-class process technology
Samsung Electronics today announced the industry's first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20 nanometer class process node.
The new 4Gb LPDDR3 mobile DRAM enables performance levels comparable to the standard DRAM utilized in personal computers, making it an attractive solution for demanding multimedia-intensive features on next-generation mobile devices such as high-performance smartphones and tablets.
- See Details